The DS26LS32 and DS26LS32A are quad differential line receivers designed to meet the RS, RS and Federal. Standards and for balanced. DS26LS32 datasheet, DS26LS32 circuit, DS26LS32 data sheet: NSC – Quad Differential Line Receivers,alldatasheet, datasheet, Datasheet search site for. DS26LS32 datasheet, DS26LS32 circuit, DS26LS32 data sheet: TI1 – DS26LS32AC/DS26LS32C/DS26LS32M/DS26LS33M Quad Differential Line Receivers.
|Published (Last):||19 July 2007|
|PDF File Size:||10.1 Mb|
|ePub File Size:||3.24 Mb|
|Price:||Free* [*Free Regsitration Required]|
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Products Applications Audio www.
DS26LS32 데이터시트(PDF) – National Semiconductor (TI)
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Pulse generator for all pulses: TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Differential Bus Transceivers Rev. Propagation Delay S1 and S2 of load circuit are closed except where shown. Nonetheless, such components are subject to these terms. Samples may or may not be available. All values shown as max or min are so classified on absolute value basis.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. Documents Flashcards Grammar checker. All trademarks are the property of their respective owners. TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.
Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof.
In no event shall TI’s liability arising out of such information exceed the total purchase price of the TI part s at issue in this document sold by TI to Customer on an annual basis. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe. Logic Diagram 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Important Information and Disclaimer: If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
TI has discontinued the production of the device. Buyers are responsible for their products and applications using TI components. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.
Products conform to specifications per the terms of the Texas Instruments standard warranty.
Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI.
Efforts are underway to better integrate information from third parties. The information provided on this page represents TI’s knowledge and belief as of the date that it is provided. TI is not responsible or liable for any such statements. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.
Resale of TI components or services with statements different from or beyond ds26lx32 parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
They are not meant to imply that the device should be operated at these limits. Use of such information may require a license from a third party under the patents or other intellectual property of the ds26l32 party, or a license from TI under the patents or other intellectual property of TI.
DS26LS32 데이터시트(PDF) – TI store
Device has been announced but is not in production. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Product device recommended for new designs. No TI components are authorized for use in FDA Class III or similar life-critical medical equipment unless dtaasheet officers of the parties have executed a special agreement specifically governing such use.
Optocouplers – Texas Instruments. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information.
DS26LS32 PDF Datasheet浏览和下载
TI does not warrant or represent that any license, either express or implied, datasheeg granted under any patent right, copyright, mask work right, or other datwsheet property right relating to any combination, machine, or process in which TI components or services are used. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
Production processing does not necessarily include testing of all parameters. Not recommended for new designs. Derate cavity package 9.