IPC Design and Assembly Process Implementation for Ball Grid Arrays ( BGAs). IPCC delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the. Lead-free solder has numerous undesirable characteristics, such as a higher melting point and reduced wetting than its leaded predecessor.
|Published (Last):||15 May 2008|
|PDF File Size:||3.4 Mb|
|ePub File Size:||17.27 Mb|
|Price:||Free* [*Free Regsitration Required]|
Ray Prasad of Prasad Consultancy Group spearheaded the effort. IPC is using a tool called SurveyMonkey. Target audiences for this document are managers, design and process engineers, as well as operators and technicians who deal with electronics assembly, inspection and repair processes. For example, there are two common approaches for designing lands for BGA – solder mask-defined and non-solder mask, or copper, defined.
7059 is a condition where reflowed solder ball and reflowed solder paste do not coalesce forming an incomplete bond that is unreliable. Another issue that is covered in detail is head on pillow. Another change in the latest iteration of IPC is that voids in solder joints, although still a concern based on their location, have become more of a process indicator.
If you participate in the survey, we will provide you with a summary of answers from industry colleagues regarding the use of BGA components. In BGAs, however, we cannot see the joints visually because they are hidden under the package, making X-ray a common inspection method.
The intent is to provide useful and practical information to the industry. The base document has undergone an extensive revision during a lengthy development by the committee that included a wide range of representatives from OEMs to fabricators to EMS companies.
Voids are seen in thru-hole and other surface mount joints. Their focus on end product reliability prompted the creation of new information that focuses on mechanical as well as ilc stresses. Therefore, voids generally are not detected.
The IPC committee decided that because it is possible to minimize voids, but almost impossible to eliminate them, it was reasonable to set a limit on acceptance criteria that can be met easily using sensible process parameters. When the committee ippc working on the new C revision, we reviewed the B rev paragraph by paragraph.
As mentioned, even though we released this document, we met at APEX kpc discuss its revision; and this is an opportunity for you to get involved. The demand for high density is increasing the number of terminations and driving lead spacing to smaller dimensions. Ball grid arrays are a dominant interconnection technology for the semiconductors used in many of the handheld portable products.
These revisions were driven in large part by customer concerns. Based on the input of this committee, I am glad to report that IPC D has been updated to include void-acceptance criteria. The incredible popularity of compact, handheld products brings a number of new challenges for designers and manufacturers. IPCD describes design and assembly implementation for ball grid array BGA and fine-pitch BGA FBGA technology, focusing on inspection, repair and reliability 70955 associated with design and assembly of printed boards using these packages.
The other area that needs to be revisited is design of land patterns for BGAs. Number of pages The other area that has received considerable attention in this revision is BGA rework using hot air and laser methods, as well as ways to prevent damage to adjacent components. If similar inspections are done for other types of components, voids definitely will be seen. Originally, many thought that these open circuits were in the solder joint or were caused by peeling copper.
Further analysis revealed a fault known as cratering, in which the resin under 77095 copper starts to fracture. It is worth noting that voids are not new to BGAs. The form also is designed such that participants may provide unique comments.
IPC-7095C Focuses on Changes in BGA Manufacturing
However, leaded surface mount and thru-hole component solder joints usually are visually inspected, not X-rayed. Click the “I agree” button to continue to use this site.
Techniques for controlling temperatures and improving solder reflow are also covered. Your answers will be summarized.
Design and Assembly of BGAs and Voiding Requirements: IPC B
As manufacturers and OEMs grapple with the challenges faced using BGAs with high lead counts and fine pitches, IPC is providing guidance for dealing with this high density. This standard describes design and assembly implementation for ball grid array BGA and fine-pitch BGA FBGA technology, focusing on inspection, repair and reliability issues associated with design ipx assembly of printed boards using these packages. There have been concerns raised in the industry, and it was highly recommended in IPC that solder mask-defined lands are undesirable because they impact reliability adversely.
The standard takes another look at X-ray inspection techniques, which have vastly improved and are often used to examine solder connections that are under the package. This problem is accentuated when large BGA packages have slight bowing at the corners and the stress is produced across those joints.
Specific solder alloy requirements are addressed for users who are attaching dissimilar package materials. Several solutions are recommended, such as putting glue dots or underfilling solder mask defined lands, as well as using excess solder paste at the corners. The recommendations for process improvement have been retained and are now in the Appendix of the document. Results of the survey will help organize the amendment being discussed for IPC B.
Preview the IPCD table of contents. The critical issue of black pad associated with electroless immersion nickel gold ENIG has been described in detail. It also provides describes how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.
As the chairman of this committee, I invite and welcome your input to help shape this important industry document. The shock often causes BGA connections to separate.